Professional IC Distribution & Technical Solutions

Global leader in semiconductor components distribution and technical support services, empowering your product innovation and industry advancement

Product Catalog Contact Us
Home > PAN > MA3DF30

MA3DF30 Specifications

Detailed technical information and Application Scenarios

Product Details

PartNumberManufactorQuantityAvailability
MA3DF30PAN307Yes

MA3DF30** is a **3DFN (Dual Flat No-Lead) package** manufactured by **Panasonic**.

The MA3DF30 is a 3DFN (Dual Flat No-Lead) package manufactured by Panasonic.

Specifications:

  • Package Type: 3DFN (3.0mm x 3.0mm)
  • Lead Count: Typically 8 or more (varies by variant)
  • Pitch: 0.5mm (standard)
  • Height: ~0.8mm (ultra-thin profile)
  • Material: Lead-free (RoHS compliant)

Descriptions & Features:

  • Compact Design: Ideal for space-constrained PCB layouts.
  • High Thermal Performance: Efficient heat dissipation due to exposed thermal pad.
  • Surface-Mount Technology (SMT): Suitable for automated assembly.
  • Reliability: Meets industrial-grade standards for durability.
  • Applications: Commonly used in power management, RF modules, and portable electronics.

For exact electrical/mechanical specs, refer to Panasonic’s official datasheet for the specific MA3DF30 variant.

Request Quotation

Part Number:
Quantity:
Target Price($USD):
Email:
Contact Person:
Additional Part Number
Quantity (Additional)
Special Requirements
Verification: =

Recommended Products

  • AN5755 ,100,SIP

    part AN5755 is manufactured by PAN (Panasonic).

  • N1224 ,245,TO3

    N1224** is a semiconductor component manufactured by **PAN (Panasonic)**.

  • 2SC3063 ,100,TO126

    2SC3063 is a high-frequency transistor manufactured by PAN (Panasonic).

  • AM93S16PC,AMD,23,DIP16

    SDC2025,,23,DIP16

Sales Support

Our sales team is ready to assist with:

  • Fast quotation
  • Price Discount
  • Technical specifications
Contact sales